Treepcb provide multi layer circuit board fabrication and assembly multilayer circuit PCB boards with BGA/FBGA usually, x-ray inspection is a must to ensure high-quality PCB BGA soldering.
Here is the x-ray BGA inspection contrast.
Treepcb Standard picture:
Full round pad, BGA balls radius and dimension is well- distributed, round shape, deep color and no blister or other defect.
Defect and description
A Defect: BGA dry joint B. defect: BGA cold soldering C. defect: short circuit
Vague BGA ball and different size irregular BGA shape tin ball connected after reflow
D defect: missing BGA PAD
BGA ball is light color in X-Ray And ball radius is smaller
1-round blaze in x-ray
2-the more light air-ball, the more series
F defect: shifting
1-Tin ball shifted≤25% accept
2-Tin ball shifted>25% unaccepted
G defect (air-ball volume=32.5%, reject: 25% = 1/4 of the tin ball
Air-ball acceptable standard：
1- air-ball volume ≤tin ball 25% accept
2- air-ball volume ≥tin ball 25% unaccepted
H DR2 balls 11*9 correct picture(single side)