Rigid PCB board
Rigid PCB board capacity
Items |
Prototype |
Mass production |
Layers |
20 Layers |
1-12 Layers |
PCB Material |
FR-4 (KB, SHENGYI)/FR-4, 170 Tg/FR-4, > 170 Tg/Teflon/Rogers 4000 |
|
Max. Board Thickness |
6.0mm |
5.5mm |
Max. Panel Size |
600*770mm(23.62″*30.31″) 500*1200mm(19.69″*47.24″) |
600*770mm( 23.62″*30.31″) |
Min. Board Thickness |
2L:0.2mm |
2L:0.2mm |
Surface finish |
HASL/HASL-LF/ENIG//Immersion Silver/Immersion Tin |
|
Max Copper |
5 OZ/175μm |
|
Min Line width |
0.08mm(3.15 mil) |
0.075mm(3 mil) |
Min Line space |
0.08mm(3.15 mil) |
0.075mm(3 mil) |
Min Hole Size |
0.1mm(4 mil) |
0.15mm(6 mil) |
Min plated hole thickness |
20um(0.8mil) |
|
Min Blind/Buried hole size |
0.2mm(8mil) |
|
PTH Dia. Tolerance |
±0.075mm(±3mil) |
|
NPTH Dia. Tolerance |
±0.05mm(±2mil) |
|
Min S/M Pitch |
Min S/M Pitch |
|
Solder mask color |
Glossy: Green/black/Blue/White/Yellow/Red |
|
Silkscreen color |
White/Yellow/Red/Black |
|
single ended impedance |
(50Ω)± 6% |
(50Ω)± 8% |
differential impedance |
(100Ω)± 6% |
(100Ω)± 8% |
Outline |
Routing/V-Groove/Beveling punch |
|
Outline Tolerance |
±0.15mm (±6mil) |
|
Peelable mask |
Top/bottom/double sided |
|
Insulation Resistance |
1×1012Ω(Normal) |
|
Through Hole Resistance |
<300Ω(Normal) |
|
Thermal Shock |
3×10sec@288℃ |
|
Warp and Twist |
≤0.7% |
|
Test Voltage |
50-330V |
