Rigid PCB board
Rigid PCB board capacity
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Items |
Prototype |
Mass production |
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Layers |
20 Layers |
1-12 Layers |
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PCB Material |
FR-4 (KB, SHENGYI)/FR-4, 170 Tg/FR-4, > 170 Tg/Teflon/Rogers 4000 |
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Max. Board Thickness |
6.0mm |
5.5mm |
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Max. Panel Size |
600*770mm(23.62″*30.31″) 500*1200mm(19.69″*47.24″) |
600*770mm( 23.62″*30.31″) |
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Min. Board Thickness |
2L:0.2mm |
2L:0.2mm |
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Surface finish |
HASL/HASL-LF/ENIG//Immersion Silver/Immersion Tin |
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Max Copper |
5 OZ/175μm |
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Min Line width |
0.08mm(3.15 mil) |
0.075mm(3 mil) |
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Min Line space |
0.08mm(3.15 mil) |
0.075mm(3 mil) |
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Min Hole Size |
0.1mm(4 mil) |
0.15mm(6 mil) |
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Min plated hole thickness |
20um(0.8mil) |
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Min Blind/Buried hole size |
0.2mm(8mil) |
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PTH Dia. Tolerance |
±0.075mm(±3mil) |
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NPTH Dia. Tolerance |
±0.05mm(±2mil) |
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Min S/M Pitch |
Min S/M Pitch |
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Solder mask color |
Glossy: Green/black/Blue/White/Yellow/Red |
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Silkscreen color |
White/Yellow/Red/Black |
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single ended impedance |
（50Ω）± 6% |
（50Ω）± 8% |
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differential impedance |
（100Ω）± 6% |
（100Ω）± 8% |
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Outline |
Routing/V-Groove/Beveling punch |
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Outline Tolerance |
±0.15mm (±6mil) |
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Peelable mask |
Top/bottom/double sided |
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Insulation Resistance |
1×1012Ω(Normal) |
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Through Hole Resistance |
<300Ω(Normal) |
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Thermal Shock |
3×10sec@288℃ |
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Warp and Twist |
≤0.7% |
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Test Voltage |
50-330V |
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