Flexible PCB design
Today’s consumers incessantly demand smaller and faster products that deliver more features and functionality at a lower cost while at the same time expecting reliability and extended battery life. The convergence of communications and computing technology in mobile consumer products with increasingly smaller footprints (PDAs with integrated cell phones and digital cameras, for example) is driving the need to re-package the electronics. Because of this, there is an ever-increasing need to maximise available space within the electronic assembly using rigid-flex printed circuit boards (PCBs). This is one of the driving factors for incorporating flexible circuits into consumer and aerospace electronics as well as other fields of electronic design
Flex pcb is called flexible pcb also which provide greater option for engineer and designer.
Rigid-flex circuits are a hybrid construction flexible circuit board consisting of rigid and flexible substrates which are laminated together into a single structure. Rigid-flex allows designers to replace multiple PCBs interconnected with connectors, wires and ribbon cables with a single package offering improved performance and reliability in all industries; Audio, Aerospace, Auto, Medical and for miscellaneous electronics manufacturing. Flexible circuits are used in a multitude of applications, ranging from the lowest end consumer products to the highest end military and commercial systems. It is no coincidence that the ranges of materials used to fabricate these circuits are as diverse in performance as the range of products in which they are used.
Overall, military aerospace and medical devices are the most common applications for rigid-flex as they are often the best way to reduce weight, and sometimes the only way to make a device feasible for the end application.
Overall, military aerospace and medical devices are the most common applications for rigid-flex as they are often the best way to reduce weight, and sometimes the only way to make a device feasible for the end application.
The use of rigid-flex printed circuits allows multiple rigid PCBs, joined with cables or wires, to be repackaged as a single circuit instead of individual boards.
There is a tendency in the design of electronic systems to combine more and higher level functionalities into smaller and lightweight packages If miniaturization of system dimensions is required, a good solution is found in the extension of the natural 2D character of electronics into the third dimension. This can be done on chip level as well as on board level. In this work, we present a methodology which enables the miniaturization of a system using both novel chip level and board level packaging technology
Proper dimensioning and tolerance of ex-circuits is vital to achieving good manufacturing yield.
CONDUCTOR SIZING AND ROUTING
CONDUCTOR SIZING AND ROUTING
In general, flexible circuit board conductor width and thickness are determined by a combination of current carrying requirements, the voltage drop
allowance and/or characteristic impedance control needs. When designing flex circuits for dynamic applications, the use of the thinnest possible copper is recommended.
CONTROLLED IMPEDANCE LINES
CONTROLLED IMPEDANCE LINES
Controlled impedance transmission cabling is a popular application for <a style="color: #008000;" href="https://www.treepcb see here.com/flexible-pcb”>prototype flexible PCB, and the value of such product is increasing as digital data signaling speeds continue to rise.
CONDUCTOR ROUTINGCONCERNS
CONDUCTOR ROUTINGCONCERNS
There are a few general issues related to conductor routing of a flex circuit. ”
The ‘first item of concern is keeping to a minimum the number of crossovers in the layout. ”
is will help to keep the layer count down and lower the cost.
Signal Integrity – The material used in the construction of flex minimizes signal loss, maintaining high-speed integrity
Impedance Control – Flex promotes a robust design pitch due to the close proximity of circuitry and ground planes/shields
Temperature Resistant – Materials used in the construction of Flex have closely matching thermal expansion rates. This causes Flex to be suitable for hot and cold temperatures as well as large temperature fluctuations.
Thermal Management – flexible circuit board does not require cooling from both sides. It also dissipates heat quickly
Thermal Management – flexible circuit board does not require cooling from both sides. It also dissipates heat quickly
.
Space Reduction – flexible circuit board is able to occupy three dimensions. It can be bent around packaging and even over
itself in order to fit into a much smaller device enclosure.
Weight Reduction – flexible circuit board is significantly thinner and lighter than traditional circuit boards; products using Flex will naturally be lighter.
